L1 · 3D teardown

SiC half-bridge power module

Laminated busbar with formed legs on the dies · Press-fit signal pins · Four parallel dies per switch

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Exploded schematic view of a SiC half-bridge: PPS housing and lid, press-fit signal pins, laminated busbar with formed legs, eight dies, two AMB substrates, solder and copper baseplate.

Layers separated along the assembly axis

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P/N gap is shown at 4× scale; values and calculation use actual d. w and l change the analytic model only.

Selected part

Laminated busbar叠层母排

Role: Connects the DC terminals and switch groups, carrying main power current. P and N form the commutation return path.
Features: Opposing currents in closely stacked P/N plates cancel part of their magnetic fields. Formed legs from each layer land directly on the die sources or substrate copper, so main current bypasses bond wires.
Common materials: Oxygen-free copper C1020, optionally nickel or tin plated; PI or PEN dielectric film with separately designed edge insulation.

Circuit topology · Linked to the model and part details

Busbar loop inductance · Parallel-plate approximation

L ≈ μ₀ · l · d / w

1.57nH

Layer gap d0.50 mm

Overlap width w40 mm

Busbar length l100 mm

Excludes fringing, terminals, dies and bond-wire inductance. Compares geometry trends; not total module parasitics or dielectric validation.

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PPS housing

Role: Frame and lid protect the internals, locate the power terminals and hold and guide the press-fit signal pins.
Features: Shown translucent to reveal the assembly. Sealing, creepage and encapsulation require separate design.
Common materials: PPS engineering polymer; grade and filler depend on the design.

DC+ / DC− terminals

Role: Connects an external DC link or capacitor to the P and N layers.
Features: Adjacent positive and negative terminals help reduce loop area; joint resistance and torque need verification.
Common materials: Copper, with optional tin or nickel plating.

AC terminal

Role: Brings out the high-side / low-side midpoint to the phase load.
Features: AC is a distinct electrical node from P/N. This model does not specify a current rating.
Common materials: Copper; surface finish depends on the joint design.

Laminated busbar

Role: Connects the DC terminals and switch groups, carrying main power current. P and N form the commutation return path.
Features: Opposing currents in closely stacked P/N plates cancel part of their magnetic fields. Formed legs from each layer land directly on the die sources or substrate copper, so main current bypasses bond wires.
Common materials: Oxygen-free copper C1020, optionally nickel or tin plated; PI or PEN dielectric film with separately designed edge insulation.

Signal pins

Role: Press-fit pins stand in holders on the housing's inner wall and pass through the lid into the driver board; bond wires join their feet to the gate and Kelvin-source traces.
Features: A needle-eye press-fit zone needs no solder. A separate Kelvin return reduces the effect of common-source inductance on gate voltage.
Common materials: Copper-alloy (e.g. CuSn) press-fit pins, commonly tin plated.

Gate bond wires

Role: Connects die gate and Kelvin-source pads to signal leads.
Features: Fine wires represent signal connections; busbars carry main power current. Wire loops and bond reliability require validation.
Common materials: Aluminium wire, illustrated at 0.3 mm diameter; actual dimensions depend on the process.

SiC MOSFET dies

Role: High-side and low-side switch groups control P–AC and AC–N paths.
Features: Eight dies, four in parallel per switch. The visual model does not validate current sharing, parasitics or gate timing.
Common materials: Silicon-carbide dies; metallization is device-dependent.

AMB substrates

Role: Provides electrical isolation while conducting die heat toward the baseplate.
Features: Two copper / ceramic / copper substrates. Copper patterning, voltage rating and thermal-cycle life require dedicated design.
Common materials: Si₃N₄ ceramic and copper joined by active-metal brazing.

Solder layers

Role: Joins dies to substrates and substrates to the baseplate, providing thermal paths.
Features: Thin layers are separated for visibility. Voids, interfaces and fatigue cannot be inferred from this geometry.
Common materials: Lead-free solder in this example; silver sintering is a distinct alternative joining process.

Copper baseplate

Role: Supports the assembly, spreads heat and interfaces to external cooling.
Features: Thickness and flatness affect thermal resistance and assembly. This model contains no coolant or flow simulation.
Common materials: Copper; composite baseplate alternatives also exist.