S1 · SIMULATION
Chip junction temperature
Steady-state conduction through an AMB stack
Junction temperature Tj
°C
Equivalent source node
- Rth,j-f
- K/W
- ΔT
- K
Above the common SiC junction-temperature limit of 175 °C
Illustrative field · local temperatures unvalidated.
Thickness direction enlarged for clarity
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Thermal resistance breakdown
0.606 K/W
Explore parameters
Fixed chip: 5 × 5 × 0.18 mm, conductivity 370 W/(m·K).
Bond layer between the chip and upper copper. Material presets change conductivity only.
A ceramic core between copper layers. Upper and lower thicknesses are independent; copper conductivity is shared.
Bond layer between the lower AMB copper and the cooler.
An equivalent convection boundary represents heat transfer to the coolant.
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