S2 · SIMULATION

Busbar Joule heating

DC conduction and steady heat conduction in the L1 half-bridge P layer, AC link and N layer

Peak conductor temperature T_max

114.6°C

Hotspot: AC link · Rise 44.6 K

Temperature°C

70.0114.6

FEM-surrogate field (POD reconstruction) interpolated on display lattice points.

Geometry 1:1. The cutaway is a horizontal section below the laminated plates, exposing the AC link and the N riser strap.

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Loss breakdown

10.24 W

Current is DC or low-frequency RMS. T_sub is the substrate temperature at the soldered pins and also the convection reference.

Current I200

50A400

Substrate temperature T_sub70

40°C100

Topology follows the switching state

DC+ → P layer → S_H → AC link → AC

AC → AC link → substrate 2 → S_L → N layer → DC−

No P-to-N shoot-through (short-circuit) case is calculated.

I / (b·t) = 83.3 A/mm²

Electrical: the terminal bolt-washer face is the equipotential current inlet; the soldered pin or source-clip faces of the conducting switch are the equipotential return; other surfaces are insulated.
Thermal: every soldered pin and clip face is held at T_sub; other exposed surfaces convect with h to T∞ = T_sub; conduction into external cables is neglected.
The three conductors are solved separately; conduction between them through the insulation film or air is neglected. Dies carry no loss, so clip faces are also held at T_sub.
Geometry is read from the L1 parameter file; when t grows, the layers move up with the L1 interlayer clearances.

R = R_g(t, b) / σP = I² RT − T_sub = I² R_g² Θ(t, b, h/k) / (σ k)

R_g and Θ come from the FEM-trained surrogate; current, σ and k scale exactly for constant properties.

Role: Distributes current from the DC+ terminal to the high-side substrate drain copper.
Features: Laminated with the N layer across an insulation film to form a low-inductance busbar; soldered to substrate 1 through a feed foot and post.
Common materials: Oxygen-free or electrolytic copper sheet, nickel or tin plated

Role: Joins the high-side sources, the low-side drain and the AC terminal to form the half-bridge midpoint.
Features: A collector bar rests on the four high-side source clips and a narrow bridge strap reaches the substrate 2 drain copper; it carries load current in both switching states.
Common materials: Stamped copper strip or copper alloy, nickel plated

Role: Collects the low-side source current and returns it to the DC− terminal.
Features: Its collector bar rises around the P-layer edge through a riser strap to the upper laminated plate.
Common materials: Oxygen-free or electrolytic copper sheet, nickel or tin plated